Deli has developped special sapphire cutting process for polished and non-polished sapphire glass, we could cut sapphire with a thickness no more than 1mm, and making micro vias, widely apply to sapphire cover glass, wafer substrate, circuit substrate, windows and optics.    

Cover glass of mobile phone (protection windows)

Chipping size@ 30micron, 0.5mm thickness



cover lens cutting (mobile phone camera protection windows)