Ceramics substrate cutting-Solution

Focus on MicroLaser fine cutting, glass cutting,micro drilling,wafer scribing,pattern etching

Focus on Micro

Solution

Ceramics substrate cutting

Normally, Laser cutting ceramics' thickness is less than 1mm, including alumina, AlN, etc.

Based on rich experience and complete facilities, we supply customized solution according to your requirements of cost, efficiency and delivery.

Laser process has advantages as following:

1. Laser processing is a cold process with a high precision and minimized thermal-effect, no touch and stress,which could meet high end applications.

2. Any geometric design, CAD input directly, no need moulding to save cost and time

3. Fine cut with laser, the min hole diameter could be 0.1mm or less, good precision at 10um.

4. Dry process, environment-friendly,meet ROHS

290um micro drilling in 0.5 thick alumina

Laser cutting of ceramics(edge quality)

square hole cutting in 0.3mm thick ceramics

Geometric cutting of 0.254mm thick alumina, apply to IC

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