Nowadays, ceramics material are widely used in the substrate of microwave( telecom) and package,especially LED packaging

   Mainly we develop fiber laser and high power UV laser sources for ceramics drilling and cutting, most of the material no more than 1mm thick, and in some situation, picosecond laser is also necessary if the customer have special requirement of edge quality

Fiber laser scribing and drilling for 1mm thick packaging substrate


Perfect roundness and edge quality