•For LED chip manufacturing with high throughput and long time reliability(7*24hours). Substrates, such as Sapphire, Copper, Silicon, Cobalt as well as Alloy, can be scribed with high precision
•Based on Delilaser’s process expertise of ultra-fast lasers, the system is latest developed to achieve a better dicing quality and scribing speed, which help to improve 8%-10% luminous efficiency of LED chips.
We could scribing not only LED wafer with sapphire substrate, but also many kinds of semiconductors wafer including silicon, glass, ceramics, SiC, metal etc
The min chip size could be 7mil*9mil and with min cutting street width@ 30um
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